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This test chamber is suitable for life test research on electrical and electronic components, printed circuit board assemblies, etc. By applying single or comprehensive stresses including high-temperature step, low-temperature step, rapid temperature change cycle, six-degree-of-freedom non-Gaussian broadband random vibration, etc., and gradually increasing the stress on these test samples, the stress limit they can withstand is determined. This helps to quickly identify product defects and make improvements in the R&D, design, trial production, and mass production stages, shorten the R&D time, and achieve the goal of rapid market launch while ensuring product quality.